In the final part of our series on using Electronics Reliability simulation tools to meet important industry standards, read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to meet the MIL-STD-810G standard relating to environmental and lab tests approved for use by the US Department of Defence.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the DO-160G standard which covers “Environmental Conditions and Test Procedures for Airborne Equipment” in the aerospace industry. PCBs installed in any airborne vehicles can be simulated in Ansys Sherlock to assess the vibrational and solder fatigue analysis in order to predict the life cycle/ Time-to-failure (TTF) of key components and the board itself.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the GMW3172 Standard for “General Specification for Electrical/Electronic Components – Environmental/Durability”, part of engineering standards by General Motors which applies to electrical components for passenger/commercial vehicles & trucks.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the SAE J3168 standard, covering Electrical, Electronic, Electromechanical Equipment, Modules and Components. This standard was jointly developed by the SAE Automotive Electronic Systems Reliability Standards Committee and SAE Avionics Process Management Committee, and is the first reliability physics analysis (RPA) standard developed specifically for use in the Aerospace, Automotive, Defence and other High-Performance (AADHP) industries.
It is increasingly important for product designers to consider electronics durability and PCB reliability across the product’s entire service life – accounting for all external influences that it will experience during production, shipping, and the environment during its operation. Here we look at how simulation is used to satisfy the requirements dictated by common industry standards.
Ansys Sherlock helps automate PCB testing to accurately predict failure risks due to thermal, mechanical and manufacturing stressors using a process that is much faster than traditional simulation due to rapid ECAD translation and a component library helping you to create a complete mechanical model of your PCB.