One of the biggest barriers to releasing a modern product can be unexpected PCB failures during physical prototype testing (due to thermal, mechanical, and/or electrical stressors). Recently LEAP ran a webinar demonstrating how Ansys can help avoid this problem by using simulation earlier in the design cycle with the new electronics reliability simulation workflow in Ansys Sherlock.
Ansys Sherlock helps automate PCB testing to accurately predict failure risks due to thermal, mechanical and manufacturing stressors. The process is much faster than traditional simulation due to rapid ECAD translation and a component library helping you to create a complete mechanical model of your PCB. In the clip below, Thomas Benke, Electronics Business Manager at LEAP Australia provides an overview of the problems facing PCB designers and the solutions Ansys Sherlock provides.
Next, Namratha Nanjaraj, Application Engineer (Electronics) at LEAP Australia guides us through a live demonstration of Sherlock, applying thermal and mechanical loads to predict the lifecycle of a PCB sitting inside a helicopter. Environmental temperature cycling, flight landing shock and propeller vibration are used as input loads to perform solder fatigue, mechanical shock and random vibration analyses. Watch the clip below to see Ansys Sherlock in action.
Finally, Thomas wraps up the session by explaining where within the overall design process simulation should be used for maximum benefit. These areas include initial part selection and placement, final bill of materials, final layout and design for manufacturing. Watch the clip below to learn more.
We hope that you found this information helpful and welcome you to contact us to learn more about how Ansys Sherlock can help improve the reliability of your PCBs. Please visit the LEAP Australia website for more information or complete this form to contact us directly.
