2018 | Finite Element Analysis (FEA) Blog – LEAP Australia & New Zealand

Guest Blog: Using Ansys Maxwell for Motor Design in Formula Student Competition

The Formula Student competition challenges engineering students from around the world to design, manufacture, market and race a small, open wheeled formula style racer. Since its inception in 2000, Monash Motorsport has competed in the Australasian competition every year, building a combustion engine powered racer. Additionally, Monash has been fortunate enough to compete against the...

What have engineers learned about Fluid-Structure Interaction from the Tacoma Narrows bridge collapse?

This week marks the anniversary of the famous collapse of the Tacoma Narrows Bridge on Nov 7, 1940 - just 4 months after it was opened (at the time it was the third-longest suspension bridge in the world - based on main span length). As engineers, we've all seen this video from our engineering...

Simulation & Additive Manufacturing: letting all your wildest (product design) dreams come true in front of your eyes

At LEAP we have been tracking the development of additive manufacturing (AM, aka 3D printing) very closely for the past decade, and we have no doubt that if you’re an engineer or product designer who has been waiting for that ‘tipping point’ in capability/cost in AM, that now is the best time to get started....

Engineers need an integrated Simulation toolset to develop and optimise safe autonomous systems

Learn how ANSYS’ integrated toolset can overcome the complex technical challenges in the development of fully autonomous systems: helping to deliver safe and reliable systems that operate efficiently in complex, changing environments. As engineers, we intuitively understand that comprehensive simulation is the only way to thoroughly consider all real-world scenarios for these systems in a fast and cost-effective way.

DCIR Analysis of PCB using ANSYS SIwave

With the trend of more densely packed integrated circuits (ICs) & more layers in printed circuit boards (PCBs) leading to the potential for overheating, thermal design of our electronic products becomes critical. To push the envelope in PCB design, learn how you can use DCIR combined with thermal analysis to increase your PCB reliability and quality.